Accepted 15 March 2021
Available Online 25 March 2021
- Copper–Aluminium–Silicon alloy
In this work, Cu–4.9% Al alloy with little Si (the weight percentage is 1.3%) and little Mn (the weight percentage is 0.8%) was deposited by wire arc additive manufacturing. Microstructure and properties of the deposited alloy was investigated. Microstructural characterization was done using optical microscopy, scanning electron microscopy and transmission electron microscopy. Microstructural investigation revealed that aluminum was enriched at the interlayer (i.e. inside the deposited layers), whereas silicon and manganese were found enriched at the border layers (i.e. at the border of the deposited layers). Evaluation of the mechanical properties showed that the deposited sample had good strength and ductility. The addition of silicon effectively improved the hardness and tensile strength properties of the deposited alloy.
- © 2021 The Authors. Published by Atlantis Press B.V.
- Open Access
- This is an open access article distributed under the CC BY-NC 4.0 license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite This Article
TY - JOUR AU - Yanhu Wang AU - Sergey Konovalov AU - Xizhang Chen AU - Yurii Ivanov AU - R. Arvind Singh AU - S. Jayalakshmi AU - Xiaoming Pan PY - 2021 DA - 2021/03/25 TI - Microstructure and Mechanical Properties of Cu–Al Alloy Deposited by Additive Manufacturing JO - Materials Highlights SP - 46 EP - 51 VL - 2 IS - 3 SN - 2666-4933 UR - https://doi.org/10.2991/mathi.k.210318.001 DO - https://doi.org/10.2991/mathi.k.210318.001 ID - Wang2021 ER -