Yanhu Wang1, 2, Sergey Konovalov1, 2, *, Xizhang Chen1, 2, *, Yurii Ivanov3, R. Arvind Singh1, S. Jayalakshmi1, Xiaoming Pan1
School of Mechanical and Electrical Engineering, Wenzhou University, Chashan Education Town, Wenzhou, Zhejiang 325035, China
Department of Metals Technology and Aviation Materials, Samara National Research University, 34, Moskovskoye Shosse, Samara 443086, Russia
Institute of High Current Electronics, Siberian Branch, Russian Academy of Sciences, 2/3, Akademichesky Avenue, Tomsk 634055, Russia
Sergey Konovalov, Xizhang Chen
Received 21 December 2020, Accepted 15 March 2021, Available Online 25 March 2021.
- Copper–Aluminium–Silicon alloy; additive manufacturing; microstructure; intermetallic phase; mechanical properties
In this work, Cu–4.9% Al alloy with little Si (the weight percentage is 1.3%) and little Mn (the weight percentage is 0.8%) was deposited by wire arc additive manufacturing. Microstructure and properties of the deposited alloy was investigated. Microstructural characterization was done using optical microscopy, scanning electron microscopy and transmission electron microscopy. Microstructural investigation revealed that aluminum was enriched at the interlayer (i.e. inside the deposited layers), whereas silicon and manganese were found enriched at the border layers (i.e. at the border of the deposited layers). Evaluation of the mechanical properties showed that the deposited sample had good strength and ductility. The addition of silicon effectively improved the hardness and tensile strength properties of the deposited alloy.
- © 2021 The Authors. Published by Atlantis Press B.V.
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